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anton shilov

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Category Articles Share
Technology_Internet 82
Business_Finance 38
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Micron plans to use wafer bonding and High-NA EUV for next-gen DRAM — company also developing vertical high-bandwidth memory and vertical edge inference memory integrated directly on top of processors
2026-10-26 — maximumpc.com


Solidigm confirms plans to build a fab in the US, abandons IPO plans — unfavorable stock market conditions and semiconductor share price trends reasons given
2026-10-23 — maximumpc.com


Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance — G11 3D NAND promises 42 Gb/mm2 and blistering 5,400 MT/s interface speed
2026-10-23 — maximumpc.com


LTO roadmap extends to 365 TB per cartridge as tape storage refuses to die — AI boom spurs relevance of cheap, airgapped storage
2026-10-22 — maximumpc.com


Micron pulls the plug on future 4F² DRAM after two decades of research in dramatic shift — company says architecture offers no meaningful density advantages, increases manufacturing complexity and costs, and has fundamental scaling limitations
2026-10-22 — tomshardware.com


Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab — confirms High-NA EUV for High Volume Manufacturing in 2028
2026-10-21 — tomshardware.com


Micron's Taiwan union will launch a one-day strike this week, threatening memory production — workers demand concrete terms for 2026 bonus and clearer profit-sharing arrangements
2026-10-21 — tomshardware.com


Modal taps Nvidia Vera CPUs after firm's internal tests show 2x throughput over Intel and AMD chips — AI agentic workflows said to favor Arm chips, but firm will keep x86 chips deployed in heterogeneous server fleet
2026-10-20 — tomshardware.com


China startup demoes prototype EUV light source — 15W of output power and 90% domestic components, still years away from viability
2026-10-16 — maximumpc.com


SK hynix reportedly playing hardball with Trump admin over 3D NAND fab — company demands increased chipmaking equipment exports to China in exchange for US fab
2026-10-15 — tomshardware.com

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